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This study examines different approaches to determining the chip failure rate that occurs due to dielectric cracking under C4 sites during chip joining. We show that testing of the strength of individual C4s by a single bump shear technique gives a strength distribution that is well described by a Weibull distribution with a Weibull modulus that lies in the range 10–20. Simulations of the spatial...
The presence of residual stresses in multicrystalline silicon solar cells has become a problem of growing importance, especially in view of silicon wafer thickness reduction. Without increasing the wafer strength, this leads to a high fracture rate during subsequent handling and processing steps. The most critical processing step during the manufacture of screen-printed solar cells is the firing of...
Cloud computing has seen tremendous growth, particularly for commercial web applications. The on-demand, pay-as-you-go model creates a flexible and cost-effective means to access compute resources. For these reasons, the scientific computing community has shown increasing interest in exploring cloud computing. However, the underlying implementation and performance of clouds are very different from...
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