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Missing ball at ppm-level has been an issue in the industry. Several mechanisms are reviewed in this paper. In general, for all surface finishes, fluxing problem is the main cause of missing ball right after BGA assembly process. Massive spalling of Cu6Sn5-based IMC is the unique cause for SnAgCu (SAC) solder ball reacting with electrolytic Ni/Au or Electroless Nickel Immersion Gold (ENIG) surface...
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