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Stress effects during metal migration and their numerical modeling methods are reviewed. A multi-physics simulation method is proposed and developed so that the electric current and stress can be solved simultaneously and the vacancy concentration predicted in a seamless framework. The stress generated by atomic movement and back stress effects [1] have been especially considered and modeled in this...
Experimental results from shear test on solder joints and Finite Element analysis method have been used to improve the creep constitutive equation for lead free SnAgCu solder alloy. Parameters in Anand's viscoplastic model that are most sensitive to the solder joint's stress-strain relationship have been identified and then modified in an inverse Finite Element analysis so that the new constitutive...
This paper describes a physics of failure (PoF) based prognostic method for power electronic modules. This method allows the reliability performance of power modules to be assessed in real time. A compact thermal model was firstly constructed to investigate the relationship between the power dissipation and the temperature in the power module. Such relationship can be used for fast calculation of...
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