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Intermetallic compound (IMC) formations of Sn–2.8Ag–0.5Cu solder with additional 1wt% Bi were studied for Cu-substrate during soldering at 255°C and isothermal aging at 150°C. It was found that addition of 1wt% Bi into the Sn–2.8Ag–0.5Cu solder inhibits the excessive formation of intermetallic compounds during the soldering reaction and thereafter in aging condition. Though the intermetallic compound...
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