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A variety of lead-free solder alloys were studied for use as flip-chip interconnects including Sn-3.5Ag, Sn-0.7Cu, Sn-3.8Ag-0.7Cu, and eutectic Sn-37Pb as a baseline. The reaction behavior and reliability of these solders were determined in a flip-chip configuration using a variety of under-bump metallurgies (TiW/Cu, electrolytic nickel, and electroless Ni-P/Au). The solder micro-structure and intermetallic...
A soil washing and leaching process was tested for removing lead from soils. A soil-washing circuit, including size and gravity separations, was employed to remove the coarse metallic lead particles, while the leaching was applied to remove fine metallic lead particles and other lead species. The soil-washing tests proved that the metallic lead particles larger than 0.15 mm (100 mesh) could be effectively...
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