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Place a Die breaking strength is related to the surface morphology of the die. Existing of the defects on the die backside makes die fracture becomes a more severe problem in the microelectronic package. In this study, impact of the die backside defects on the stress is investigated by mechanical theories. Finite element method and 3 point bending test are used to verify the theory prediction. Thin...
The ability to improve the mechanical properties of a microelectronic package, including reducing the thermal-mechanical stress and increasing the die breaking strength is a long-sought goal in electrical assembly and packaging technology. Failure modes related with die backside stress caused by warpage or cosmetic defects may occur without a well control of die-backside stress. In this study, the...
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