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Thermal interface materials (TIMs), including thermal conductive adhesives (TCAs), grease, phase change materials (PCMs) and thermal pads, are widely used in thermal management for electronics system. In this work, a bimodal thermal conductive adhesive (b-TCA) composed of epoxy matrix and silver fillers were developed. The silver fillers consist of silver flakes and silver particles. The specimens...
Thermal interface materials have been widely adopted in the thermal management for electronics system. Most of the thermal interface materials are made of polymers with thermally conductive particles distributed inside to enhance the thermal conductivity. Thus it is essential to figure out the effective thermal conductivity of this composite material. In the present paper, a parameterized cubic cell...
Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested...
As power density in electronic system is approaching a level that conventional cooling methods canpsilat handle, reliability of microsystems is of large concern. In this paper, novel schemes for heat dissipation on electrical components have been reviewed with a strong focus on using carbon nanotubes (CNTs) as cooling fins as a basic approach. With an extraordinary high thermal conductivity, CNT is...
Thermal management in electronics packaging is becoming more rigorous with the increase of IC power. A common method is to transfer heat from the heat generating devices using a heat dissipation member, for example heat sink. Thermal interface material (TIM) is applied between the heat source component and the thermally conductive member to offer a fast heat dissipation path. Nano thermal interface...
Summary form only given. One important function of microsystem packaging is to remove the heat generated by the integrated circuits (ICs). The thermal management of microsystems has now become more crucial as the power density of ICs increases dramatically. To remove the big amount of heat is a big challenge for the packaging technology. An attractive solution is to utilize new developed nanotechnologies...
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