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The failure mode of Sn-4.0Ag-0.5Cu solder joints under the intermediate strain rates is explored. Tensile and shear tests were performed on miniature solder joints at two different displacement rates, i.e., 5 and 50 mm/s. For the uniaxial tensile test, brittle failure occurred at the intermetallic compound (IMC)/Cu pad interface on the board side under both loading rates. However, for shear loading...
The interface damage of single solder joint was simulated using cohesive zone model incorporated in finite element analysis. In this study, the solder/IMC/Cu pad interfaces models were constructed for the molecular dynamics simulation. The traction-separation law was derived when the interface model was subjected to a principle strain in one direction. The materials properties of cohesive element...
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