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Vacuum brazing of copper to SiO2 electroceramics was carried out using commercially obtained Ag-Cu-Ti filler alloy. The effects of brazing temperature and bonding time on the interfacial microstructure and mechanical properties were investigated. The microstructure observation revealed that the typical interfacial structure could be expressed as SiO2 ceramic/Ti5Si3 + Ti4O7/Ti2Cu + Ti3Cu3O/Ag (s,s) + Cu...
Cu nonmagnetic metallic nanoclusters were embedded in the ZnO thin film by using nanocluster beam deposition. No presence of secondary phase was detected in X-ray diffraction (XRD) analysis, but secondary phases CuO and CuO nanoclusters were detected in films by transmission electron microscopy (TEM). Cu nanoclusters embedded in ZnO films have the average particle size around 8–10 nm. Cu atoms...
Ultrathin Cu films with thicknesses d between ~10 and 40 nm were thermally evaporated onto ~500-nm thick SiO 2 on Si(100) substrates in an ultra high vacuum (UHV) chamber with a base pressure of 5x10 -10 torr. The sheet resistance R (Ω/ ), was measured in situ at different film thicknesses by a collinear four-point probe. The infinite R at d<10 nm suggested that the film...
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