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Established methods for filling through holes in core layers of HDI and IC substrates are labor intensive, multistep processes that rely on mechanical filling with epoxy or paste after conformal through hole metallization, planarization, and a cap layer of electrodeposited copper before subsequent build-up of additional dielectric layers. Additionally, the mechanical strength and thermal conductivity...
Electrolytic copper microvia filling is an enabling technology, prominently used in today's manufacture of advanced HDI and packaging substrate product. In the high volume mass production of copper filled microvias, a wide variety of electroplating equipment designs are available to the fabricator. In this article, various aspects of electroplating equipment design used in the mass production of copper...
As higher and higher pin-count semiconductor packages are deployed in telecommunications and data processing applications, Printed Circuit Board (PCB) substrates must evolve to allow increased routing densities. To be capable of meeting these routing density and complexity needs, higher layer counts must be combined with filled microvias. High Density Interconnect (HDI) product of this type places...
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