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Junction leakage is becoming an important reliability concern as shallow trench isolation (STI) continues to scale down. This junction leakage has to be considered to improve SRAM Vccmin degradation. The major index of junction leakage in SRAM cell is found to be off-state leakage current as the leakage phenomenon externally manifests as a current flow from butted contact (BCT) to lower pull down...
This paper presents a state-of-the-art 28nm CMOS technology using conventional poly gate and SiON gate dielectric (Poly/SiON) with best-in-the-class transistor performance, SRAM SNM (static noise margin), MOM capacitance density and mismatch, and ULK (k=2.5) interconnect. The ION are 683 and 503 uA/um (at IOFF = 1nA/um, VDD=1V) for the n- and p-MOSFET, respectively. (With normalized tOX and VDD, these...
This paper reports a 45 nm spin-transfer-torque (STT) MRAM embedded into a standard CMOS logic platform that employs low-power (LP) transistors and Cu/low-k BEOL. We believe that this is the first-ever demonstration of embedded STT MRAM that is fully compatible with the 45 nm logic technology. To ensure the switching margin, a novel "reverse-connection" 1T/1MT cell has been developed with...
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