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Wire sawing is one of the most prominent technologies for producing solar wafers. In the following paper a numerical model for the simulation of the wire sawing process at microlevel using the discrete element method is presented. The abrasive particles are represented by convex polyhedra. Based on the contact forces on the ingot, local material removal rates are calculated. These local material removal...
The material removal rate in the wire sawing technology depends on several features of the used abrasives and the complex process of particle movement and interaction inside the kerf. To investigate these micro-mechanical aspects of the wire sawing process, a numerical model is developed in the present paper. The model is based on the discrete element method adjusted to use sharp edged polygonal particles...
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