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For several years researchers have been investigating the interactions between solvated lipid bilayers. Presently there is some disagreement regarding the range, magnitude, and origin of the long-and short-range repulsive and attractive interactions between bilayers. To address this issue experimentally, we have used the osmotic stress/X-ray diffraction method to measure the total repulsive pressure...
Thin film characterization, electrical performance, and preliminary reliability of physical vapor-deposited (PVD) TaN/chemical vapor-deposited (CVD) Ru bilayer were carried out to evaluate its feasibility as a liner layer for back-end of line (BEOL) Cu-low k integration. Adhesion and barrier strength were studied using 4-point bend, X-ray diffraction (XRD), and triangular voltage sweep (TVS) techniques...
We describe a liner for Cu-Damascene multilevel ULSI interconnects, which satisfies all the important requirements for a high performance and reliable Cu interconnect technology. This liner is implemented in the first manufacturing process to produce and ship CMOS chips with Cu interconnects. The liner is a bilayer from a family of hcp/bcc-TaN followed by bcc-Ta (/spl alpha/-Ta), deposited sequentially...
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