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Intermetallic phases formed along a Sn-Ag eutectic solder/Cu interface during solid-state aging have been characterized and the activation energies of Cu3Sn and Cu6Sn5 growth have been calculated. Diffusion couples consisting of Cu/ 96.5Sn-3.5Ag/Cu were aged at 110 to 208°C for 0 to 32 days. After aging, the Cu/ solder interfaces were examined using scanning electron microscopy and energy dispersive...
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