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We propose a diamond-shaped interrupted microgrooved cooling fin to decrease the junction temperature variation across the chip. The analytical result indicates that the junction temperature variation decreses to less than 25% compared with a conventional paralles-plate-shaped cooling fins. This cooling structure is sufficient to cool high-power-consumption silicon chips.
We have evaluated the relationship between the cooling capability and the channel width with a constant pressure drop for microgrooved cooling fins, and found that there are optimal channel widths which give rise to the maximum allowable power density. There are also optimal microgrooved cooling fin structures in which enlarged channel widths are sufficient to cool high-power-consumption wafer-scale...
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