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A multilevel back-end-of-line structure with a dielectric constant κ ≤ 2.4 ultra low-κ materials was developed. κ=2.2 ULK build was demonstrated at a 144nm wiring pitch and a κ=2.4 ULK was demonstrated at a 288nm pitch. Good model-to-hardware correlation for the measured capacitance indicated no significant plasma damage to the ULK 2.2 material. The extracted copper resistivity was consistent with...
Interconnect process features are described for a 32 nm high performance logic technology. Lower-k, yet highly manufacturable, carbon-doped oxide (CDO) dielectric layers are introduced on this technology at three layers to address the demand for ever lower metal line capacitance. The pitches have been aggressively scaled to meet the expectation for density, and the metal resistance and electromigration...
Prion diseases are fatal neurodegenerative disorders that affect both humans and animals. The rapid clinical progression, change in protein conformation, cross-species transmission and massive neuronal degeneration are some key features of this devastating degenerative condition. Although the etiology is unknown, aberrant processing of cellular prion proteins is well established in the pathogenesis...
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