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An improved solder structure with an ultrafine grain size of ∼200–500 nm and significantly enhanced mechanical properties has been created by incorporating nanosized, nonreacting, noncoarsening oxide dispersoids into solder alloys. These solders display up to three orders of magnitude reduction in the steady-state creep rate, 4–5 times higher tensile strength at low strain rates, and improved ductility...
The record-high thermal conductivity of high-quality diamond makes it a natural choice for many applications in thermal management. The columnar microstructure of chemical-vapor-deposited diamond thick films, however, causes anisotropy and a strong gradient in the conductivity, both of which can be understood in terms of phonon-scattering defects that aggregate near grain boundaries. Techniques to...
Thermal management is an important issue in electronic packaging due to the increasing complexity, miniaturization, and high density of components in modern devices. In high-power-dissipation packages, heat sinks are essential for preventing thermal damage to heat-sensitive components on the silicon chip. However, commonly used heat-sink materials (e.g., copper and aluminum alloys) have a much higher...
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