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The grain-boundary diffusion (GBD) of germanium in copper and its alloys Cu-2% Ge and Cu-0.5% Fe is investigated in the temperature range of 500–590°C by means of electron-probe microanalysis. The GBD parameters (triple product P = sδDGB and effective activation energy E) are found. The temperature dependence of the triple product for germanium GBD in pure copper can be described by equation P =...
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