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A thin film, NiMoNb, was introduced as an adhesion layer between the Cu metal and the insulator polyimide substrate in a flexible Cu-clad laminated structure. Using 90° peel test, we evaluated the peel strength of the system as a function of the thickness of the adhesion layer. An increase in the NiMoNb thickness from 7 to 40nm enhanced the peel strength of the deposited systems. After plasma treatment...
A molecular photodiode was fabricated with the hetero-Langmuir-Blodgett (LB) film consisting of an electron acceptor (A), a sensitizer (S) and an electron donor (D). N-Docosylquinolinium TCNQ, 10-(1-pyrene) decanoic acid and 1-1 -ferrocene-N-dioctadecyl carboxamide were used as A, S and D units, respectively. One-way electron transfer from D to S was observed with cyclic voltammetry for the modified...
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