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This paper presents bootloader and debugger architectures that are designed for an NoC-based Multiprocessor System On-Chip (MPSoC). An MPSoC demands scalable bootloader and debugger architectures, especially with the increasing of the number of the processor cores. The proposed bootloader and debugger designs utilize the NoC interconnect network to distribute data to and from the cores. With this...
With evaluation of various dense silicon-oxy-nitride (SiON) films, a critical density and thickness against to Cu diffusion into Si substrate has been evaluated. Density of SiON films varied with deposition temperature using Plasma-Enhanced Chemical-Vapor-Deposition (PECVD) was ranged from 56% to 69% for bulk film. Cu diffusion increased with decreasing the film density, resulting in 3.5 × 1010 cm...
Mechanical stress, crystal defects, and metal contamination in thinned silicon substrates with and without intrinsic gettering (IG) zone have been investigated for three-dimensional (3D) integration. The remnant stress existing after wafer thinning was evaluated using angle-(5deg) polished silicon wafers by micro-Raman spectroscopy (muRS). The metal contamination in the thinned silicon substrates...
We developed novel interconnection technology for heterogeneous integration of MEMS and LSI multi-chip module, in which MEMS and LSI chips would be horizontally integrated on substrate and vertically stacked each others. The cavity chip composed of deep Cu TSV-beam lead wires was developed for interconnecting MEMS chips with high step height of more than 100 um. Fundamental characteristics were successfully...
A very new interconnection method, namely Cu lateral interconnection is proposed and tested for the heterogeneous multi-chip module integration in which MEMS and LSI chips are self assembled onto the flexible substrate. Here, the lateral interconnects runs between a few hundred microns thick chip and the Si or flexible substrates as well as at inter chip level. These Cu lateral interconnects were...
We have newly proposed heterogeneous multi-chip module integration technologies in which MEMS and LSI chips are mounted on Si or flexible substrates using a self-assembly method. A large numbers of chips were precisely and simultaneously self-assembled and bonded onto the substrates with high alignment accuracy of approximately 400 nm. Thick MEMS and LSI chips with a thickness of more than 100 mum...
The design, fabrication, and characterization of a 112 channel, 5 MHz, two-dimensional (2-D) array transducer constructed on a six layer flexible polyimide interconnect circuit is described. The transducer was mounted in a 7 Fr (2.33 mm outside diameter) catheter for use in real-time intracardiac volumetric imaging. Two transducers were constructed: one with a single silver epoxy matching layer and...
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