The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The interfacial stresses and chip cracking stress produced because of thermal and mechanical mismatch in layered electronic assembly are one of main reasons for the failure of electronic packages. The analytical model considering the nonlocal deformation of assembly was developed and applied to predict the interfacial stresses produced due to temperature variation for the short and long anisotropic...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.