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The effect of intermetallic compound (IMC) thickness on tensile behavior of the Cu/Sn/Cu micro interconnects was investigated after thermal aging under synchrotron radiation experiments, and the tensile strength of the full IMC interconnects was also measured. The results showed that a thicker IMC layer induced a higher tensile strength of the Cu/Sn/Cu interconnects. The average tensile strength of...
The continuous downsizing of solder interconnect will significantly affect the wetting reactions between solder balls and pads and the cross-interaction of opposite heterogeneous pads, which further affects the reliability of the interconnect. In the present work, Cu/Sn-3Ag-0.5Cu/Ni-P solder interconnects with ball diameters of 200, 300, 400 and 500 μm were reflow soldered to study the size effect...
The continuous downsizing of solder interconnect will significantly affect the wetting reactions between solder balls and pads and the cross-interaction of opposite heterogeneous pads, which further affects the reliability of the interconnect. In the present work, Cu/Sn-3Ag-0.5Cu/Ni-P solder interconnects with ball diameters of 200, 300, 400 and 500 μm were reflow soldered to study the size effect...
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