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Low-temperature silver sintering technology, which has been proven to be a promising die-attach solution, was extended to bonding large substrates. Strong bonding strengths for substrates greater than 25 mm × 50 mm were achieved by sintering a nanosilver paste at temperatures below 270°C with less than 5 MPa pressure. To characterize thermal performance of the substrate-attach interface, we applied...
One of the most important steps in the manufacturing of laser diodes is bonding the chip onto some sort of sub-mount that allows the laser to be handled, durable electrical connections to be made, and heat to be conducted away from the laser itself. The ability to conduct heat away from the laser is critical in keeping operating temperatures low, thus improving the laser's performance and its lifetime...
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