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Low-temperature silver sintering technology, which has been proven to be a promising die-attach solution, was extended to bonding large substrates. Strong bonding strengths for substrates greater than 25 mm × 50 mm were achieved by sintering a nanosilver paste at temperatures below 270°C with less than 5 MPa pressure. To characterize thermal performance of the substrate-attach interface, we applied...
Nanosilver paste is a promising lead-free die-attach material suitable for power electronic packaging, particularly for high-temperature applications. Compared with traditional hot pressing to sinter nanosilver, rapid sintering by a pulse current is able to sinter nanosilver in less than a second. To investigate the nanosilver sintering process during rapid sintering, we characterize the temperature...
Heat dissipation for packaging high-power light-emitting diodes is critically important to performance and reliability of LED lighting modules. The first thermal interface encountered by the heat flow is a die-attach material between the diode chip and its substrate. In this study, three different types of die-attach materials were used to construct 1-Watt GaN LED single-chip modules: a silver epoxy...
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