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Low temperature sintered nano-silver paste becomes a potential alternative in green electrical packaging because of its higher thermal and electrical conductivity than conventional solders. It can be used for connected chips that require high temperature operation, such as high power LED and power electronics modules, etc. During service, alternating shear strain, even thermal fatigue failure will...
Heat dissipation for packaging high-power light-emitting diodes is critically important to performance and reliability of LED lighting modules. The first thermal interface encountered by the heat flow is a die-attach material between the diode chip and its substrate. In this study, three different types of die-attach materials were used to construct 1-Watt GaN LED single-chip modules: a silver epoxy...
We present an interconnect technology based on low-temperature and pressureless sintering of a nanoscale metal paste to achieve high-performance and high-temperature packaging of semiconductor devices. The nanoscale metal paste, consisting of nanoparticles of silver mixed in an organic binder/solvent vehicle, can be sintered at temperatures close to 275degC. Measurements on electrical and thermal...
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