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Three-dimensional multiple-input multiple-output (3D MIMO) is one of the most promising techniques for the fifth-generation (5G) mobile communication systems. In order to catch the the propagation characteristics of the 3D channel, extensive measurements have been carried out. Although outdoor to indoor (O2I) scenarios is one of the main propagation of 3D MIMO channel, it remains too much work to...
The backpressure algorithm has been widely used as a distributed solution to the problem of joint rate control and routing in multi-hop data networks. By controlling a parameter V in the algorithm, the backpressure algorithm can achieve an arbitrarily small utility optimality gap. However, this in turn brings in a large queue length at each node and hence causes large network delay. This phenomenon...
This paper presents a high-speed energy-efficient analog-to-digital converter (ADC) with two-channel time-interleaving on an asynchronous pipelined-flash architecture for each channel. With use of multiple sampling paths as well as asynchronous control by a low-power 6-phase clock generation, the proposed ADC eliminates power-hungry and bandwidth-limited residue amplifiers without sacrificing the...
The most critical challenge facing mobile millimeter wave communication is the precise projection of high-gain and narrowly focused radiation toward the multi-paths leading to a device as it moves and rotates in the field. In order to design and evaluate such beam tracking mechanism, an accurate model of the propagation environment is required. Unfortunately, conventional channel models for system...
A new time-delay estimation method based upon Cubic spline interpolation and Area bary center algorithm that is well suitable for determining the time-delay between two noisy band-limited signals is introduced. Unlike conventional correlation algorithm, the new approach has the ability to optimally estimate any non-integral sample delay only using Cubic spline interpolation and Area bary center algorithm...
One memory-logic-integration design platform is developed in this paper with thermal reliability analysis provided for 2.5D through-silicon-interposer (TSI) and 3D through-silicon-via (TSV) based integrations. Temperature-dependent delay and power models have been developed at microarchitecture level for 2.5D and 3D integrations of many-core microprocessors and main memory, respectively. Experiments...
3He detector has been widely used for security and neutron scattering. Due to 3He supply crisis, alternative thermal neutron detection technique is studied. For the adequate 10B supply and its large cross-section with thermal neutron, boron coated straw detector (BCSD) is a good choice to replace the 3He tube. To achieve high thermal neutron detection efficiency, a BCSD module usually consists of...
Though 3D TSV/TSI technology provides the promising platform for heterogeneous system integration with design drivers ranged from thousand-core microprocessor to millimeter-cubic sensor, the fundamental challenge is lack of light to deal with significantly increased design complexity. From device level, new state of variables from different physical domains such as MEMS, microfluidic and NVM devices...
This letter analyzes the statistical properties of the root-mean-square (RMS) delay spread in a two-path distributed antenna system, where the received signal power from each path is subject to composite gamma fading and lognormal shadowing. The channel power delay profile considered consists of two delta functions with correlated power levels. We present analytical expressions for the probability...
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