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We studied the mechanism and morphological evolution of a thermal interface material prepared by pressureless sintering of a paste containing silver nanoparticles (Ag NPs) flocculated with citrate or nitrate. A high thermal conductivity (>100W/K-m) was obtained from the material sintered at 453K for 30min. Significant crystallization and large amounts of twins were observed in the material. These...
We report a Cu-to-Cu interconnects fabrication process based on the pressureless low temperature sintering of Ag nanoparticles for electronic packaging. The organic shells of citrates covering the nanoparticles stabilize the Ag nanoparticles. It is not necessary for organic shells to be completely decomposed for sintering to take place. Instead, it is sufficient that the chemical bonds that connect...
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