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Solder joint thickness has an important effect on the fatigue failure behavior of solder joint. In this study, fatigue behavior of solder joints with different solder thickness (0.1mm, 0.2mm, 0.3mm) were studied under 398K. The failure path and rupture morphology were observed utilizing scanning electron microscopy (SEM) in order to reveal the failure mechanism. Moreover, fatigue life was evaluated...
Solder joint thickness has an important effect on the fatigue failure behavior of solder joint. In this study, fatigue behavior of solder joints with different solder thickness (0.1mm, 0.2mm, 0.3mm) were studied under 398K. The failure path and rupture morphology were observed utilizing scanning electron microscopy (SEM) in order to reveal the failure mechanism. Moreover, fatigue life was evaluated...
As the failure of solder joints under thermal cycling is as a result of creep-fatigue damage evolution, the failure mechanism of SnAgCu solder was studied by using the theory of continuum damage mechanics (CDM) and a new damage model was proposed here. A special bimetallic load frame with single joint-shear sample was designed to simulate actual joints in electronic packages. Thermo-mechanical cycling...
Stress of foundation pile is more sensitive than the other monitoring indexes such as displacement, so it can be observed to show run behavior more efficaciously. Stress components must be separated by influence factors, and stress monitoring model can be built by the relationship of stress components and their influence factors. Wavelet shows good characteristics in time-frequency domain, so it has...
Pin-through-hole (PTH) connection is one of the most common types of connection between components and circuit board. Taking the printed circuit board (PCB) of the typical electronic product air conditioner as research object, thermal fatigue behavior and failure mechanism of the through-hole solder joints were investigated by accelerated aging experiments and finite element analysis (FEA). Results...
SnAgCu solder is fast becoming a reality in electronic manufacturing during to marketing and legislative pressure. This paper studies the thermal fatigue life of flip chip by the application of thermal fatigue life prediction model. The required life prediction model for SnAgCu solder joint is based on fatigue-creep interaction damage theory. In same test condition, the actual life of flip chip is...
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