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Multi-core digital signal processor (DSP) and system on chip (SoC) are widely used in LTE base band these years. A companion paper (Hao Xiang et at., 2013) [1] presented a kind of 3 layers multi-core DSP/SoC software architecture, and mentioned the common IPC is the key for this flexible architecture. This common IPC is detailed in this paper. LTE system has hundreds of configurations from different...
Multi-core digital signal processor (DSP) and system on chip (SoC) are widely used in Long Term Evolution (LTE) L1 development since 5 years ago. The corresponding multi-core software architecture design is a big challenge. Nowadays, a traditional 3 layers architecture is very popular. Its 3 layers are accelerators driver layer, OS layer and application layer. One shortage of this architecture is...
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