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Through-Silicon Via (TSV) is a technology that enables vertical integration of silicon dies forming a single 3D-IC stack. In this paper, a practical model is proposed for the TSV assignment problem of the stacked-die 3D nets. We present the first work in the literature to prove that the general 3D-IC TSV assignment problem with more than two dies is NP-complete. An efficient heuristic algorithm that...
This paper describes a solution for global routing and track assignment of flip-chip I/O nets. Voronoi Diagram (VD) is used to partition the open routing space and the geometrical properties of VD graph are exploited to create global routing channels with capacity and congestion considerations. A network flow algorithm is used to achieve optimal global routing. The regularity of the flip-chip bump...
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