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Sn-58Bi alloy particles and La2O3 were mechanically mixed and melted to prepare the composite solder. The microstructures of the solder and the IMC grain sizes were analyzed. Morphology results showed that the adding of La2O3 could restrain the segregation of Bi-rich phases and reduce the brittleness of the solder alloy. The hardness of solder increased with the addition of La2O3, which were tested...
The micro solder joints serve as mechanical supporting and electrical connections in assembly of WLCSP devices on board-level. As the requirements of miniaturization, weight reduction in modern electronic devices, the dimension of solder joints is decreasing as small as 100um due to higher-density connections and smaller chip size. The integration of the solder joints is one of the key problems related...
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