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The subject of this study was to investigate the effect of different geometrical loop shapes on the reliability of 400 µm thick Al bond wires in IGBT modules by means of experimental and analytical methods. The experimental fatigue tests have been realized by linear cyclic displacements of 5–45 µm of the contact plates at 200 Hz and 20 kHz. Life time curves were obtained for bond wire connections...
A review of several years effort to enable reliability prediction in microelectronic packages with respect to interface fracture under mechanical and thermo-mechanical stress loads is provided. Problems, solutions, results and links between activities are summarized. Methods and status to measure the critical energy release rate to propagate a crack Gc=Gc(Ψ(lref), T, C), especially its dependence...
The flip chip technique using conductive adhesives have emerged as a good alternative to solder flip chip methods. Different approaches of the interconnection mechanism using conductive adhesives have been developed. In this paper, test chips with gold stud bumps are flip-chipped with conductive adhesives onto a flexible substrate. An experimental study to characterize the bonding process parameters...
Forward Error Correction (FEC) and spatial diversity techniques are considered for improving the reliability of high-data-rate military satellite communication (MILSATCOM) over a slow-fading, nuclear-disturbed channel. Slow fading, which occurs when the channel decorrelation time is much greater than the transmitted symbol interval, is characterized by deep fades and, without special precautions,...
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