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In this paper, surface activated bonding (SAB), as a new high density bonding method and its application on the interconnection between metal micro-bump and metal film for the chip-on-chip and chip-on-flex/chip-on-film system, was introduced. Bonding feasibility of Au bump and Al film in the vacuum at room temperature, Au bump and Cu film, Au bump and Au film, and Cu bump and Cu film in air or nitrogen...
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