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The third generation enhanced heat transfer technologies, such as three-dimensional fin and dimple, are still important means of improving energy efficiency and will continue to be challenging issues. This paper concentrates on the analysis of the condensation heat transfer performance of an edge-shaped finned-tube fabricated by extrusion–ploughing process. Experimental results show that the overall...
In order to ensure the normal work of electronic product, the thermal management is of key importance. Miniature loop heat pipe (mLHP) is a promising device of heat transfer for electronic products. Cu-water nanofluid with different concentration is used as working material in mLHP. Experiments are conducted to investigate its heat transfer performance. The heat flux owing to thermal diffusion is...
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