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Influences of temperature and Sn-Cu droplet’s composition on reactive wettings of Cu(100), Cu(110), and Cu(111) surfaces were analyzed, by using molecular dynamics (MD) calculations. As a result, the spreading on Cu(110)(Cu(100)) has the fastest (slowest) wetting kinetics. A higher temperature or a diluter Cu content in the Sn-Cu alloy droplet results in a higher wettability. Moreover, this work has...
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