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Thermal histories of inverter components were collected from operating inverters from several manufacturers and three locations. The data were analyzed to determine thermal profiles, the dependence on local conditions, and to assess the effect on inverter reliability. Inverter temperatures were shown to increase with the power dissipation of the inverters, follow diurnal and annual cycles, and have...
Thermal histories of inverter components were collected from operating inverters from several manufacturers and three locations. The data were analyzed to determine thermal profiles, and the dependence on local conditions, as well as to assess the effect on inverter reliability. Inverter temperatures were shown to increase with the power dissipation of the inverters, follow diurnal and annual cycles,...
In flip chip microelectronic packages, solder bumps are used to connect the silicon die and package substrate for electrical functionality. However, due to the large mismatch of silicon and organic package in the coefficient of thermal expansion (CTE), the solder bumps undergo large viscoplastic deformation in temperature cycling test and in field operation. The viscoplastic damage accumulates cycle...
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