Serwis Infona wykorzystuje pliki cookies (ciasteczka). Są to wartości tekstowe, zapamiętywane przez przeglądarkę na urządzeniu użytkownika. Nasz serwis ma dostęp do tych wartości oraz wykorzystuje je do zapamiętania danych dotyczących użytkownika, takich jak np. ustawienia (typu widok ekranu, wybór języka interfejsu), zapamiętanie zalogowania. Korzystanie z serwisu Infona oznacza zgodę na zapis informacji i ich wykorzystanie dla celów korzytania z serwisu. Więcej informacji można znaleźć w Polityce prywatności oraz Regulaminie serwisu. Zamknięcie tego okienka potwierdza zapoznanie się z informacją o plikach cookies, akceptację polityki prywatności i regulaminu oraz sposobu wykorzystywania plików cookies w serwisie. Możesz zmienić ustawienia obsługi cookies w swojej przeglądarce.
In this paper, a wearable antenna for wireless local area network (WLAN: IEEE 802. 11a, n −5.725 GHz ~ 5.825 GHz) band applications using a stacked square ring patch element is proposed. It consists of a micro strip line with indirect feeding method and a stacked square ring patch. It is designed on a flexible printed circuit board (PCB). The proposed antenna shows good characteristics such as a WLAN...
We report the design, fabrication and testing of an optimized 6-stage planar thermoelectric (TE) micro cooler producing a DeltaT = 22.3degC at a power consumption of 26 mW, the best performance reported to date for a thermoelectric microcooler. This microcooler has a compact chip-scale design, and utilizes Bi2Te3 and Sb2Te3 thermoelectric thin films deposited on thermally isolating silicon oxide bridges...
The current trend in the electronics industry is to decrease the size of electronic components while attempting to increase processing power and performance. This is leading to increased interest in thinner printed wiring boards and finer line width and pitch. However, these goals can be hindered by the occurrence of warpage in the manufacturing and assembly process of electronic packages from mismatches...
We report: (1) the design, fabrication, and testing results of an implantable micro-scale thermoelectric power scavenging device that utilizes the body temperature of beetles as an energy source, (2) measurements of beetle body temperature during flight and (3) the developmental stability of beetles with implanted devices. The implantable energy scavenger consists of multiple Bi2Te3 legs and long...
In this paper, low cost and highly compact band pass filters and duplexers are investigated for Dual-band WiMAX FEM (front-end module) with multi-layered organic package substrate. This dual band FEM includes a 2,5 GHz power amplifier die with switch and should have tiny PKG form factor for small mobile applications. In addition to module size limitation, FEM requires higher gain and stringent attenuation...
Research on high-k (HfO2) materials has been expanded significantly. However, MOSFETs with high-k gate dielectrics on silicon still have several problems with relatively low mobility of high-k devices in thin EOT regime compared to the universal curve. In this work, as an alternative of silicon substrate, InP and In0.53Ga0.47As has been studied. W e present the material and electrical characteristics...
We present the systematic study of the growth mechanism of ZnO nanorods grown on Al2O3 substrates with ZnO homo-buffer, n-GaN and p-GaN interlayers. Vertically aligned ZnO nanorods with diameter of 50 nm and lengths of range of 0.1 - 2 mum were synthesized at the substrate temperature of 350 - 500degC by catalyst-free metal-organic chemical vapor deposition. A thin ZnO film was observed underneath...
We prove that build-up of evanescent surface waves are responsible for the enhanced transmission, by comparing periodic and random arrays of holes punctured in metal and dielectric absorber substrate.
Podaj zakres dat dla filtrowania wyświetlonych wyników. Możesz podać datę początkową, końcową lub obie daty. Daty możesz wpisać ręcznie lub wybrać za pomocą kalendarza.