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Localized laser bonding using a glass frit intermediate layer is an ideal technology to hermetically package devices without heating the function components. The glass frit paste is mainly composed of functional fillers, low temperature vanadate glass powder and organic carrier. The viscosity of glass frit has an important influence on screen printing, pre-sintering and laser bonding quality. The...
Localized laser bonding using a glass frit intermediate layer is an ideal technology to hermetically package miniature devices without heating the function components. It is important to describe the laser energy transmission and absorption in glass frit when modeling heat transfer in transmission laser bonding of glass to glass. Excess energy leads to over-burning of the glass material and deficit...
Localized laser bonding using a glass frit intermediate layer is an ideal technology to hermetically package miniature devices without heating the function components. It is important to describe the laser energy transmission and absorption in glass frit when modeling heat transfer in transmission laser bonding of glass to glass. Excess energy leads to over-burning of the glass material and deficit...
In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/fllms (ACAs/ACFs) and nonconductive adhesives/fllms (NCAs/NCFs) is introduced for next generation high-performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z direction with relatively...
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