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In this paper an improved LED (Light emitting diode) packaging structure was proposed, which is based on COB (Chip On Board) technology. This research mainly analyzed the thermal reliability of a 4×4 square LED die array with COB technology during temperature load. Simple intuitive for observation, two specific red glue curing profiles were compared with different curing temperature, curing time,...
Package-on-package (PoP) is one of the major 3D packaging approaches. It vertically combines discrete memory and logic ball grid array (BGA) packages, where one package rests on the top of another. Recently, PoP technologies have attracted more interests, especially for portable electronics related products and applications. For the existing PoP solutions, they have the following disadvantages: (i)...
In Flip Chip package, the curing process of the underfill polymer will induce extra residual stress and strain fields. For simplicity reasons, in thermo-mechanical analyses, the curing induced stress state was usually neglected by assuming a so-called ldquostress-freerdquo temperature. However, such simplification is not verified, in particular for advanced IC chips such as copper-low-k interconnects,...
Thermosetting polymers are widely used in electronic packaging. For instance, epoxy molding compound is extensively used as an encapsulant for electronic packages to protect the IC chips from mechanical and chemical hazards. It is well known that molding compounds show not only strong temperature dependent but also time dependent behavior. The thermo-mechanical behavior of these polymer constituents...
Evidence of the Au segregation within the crack region in laser welded Au-coated Invar material for semiconductor laser packaging is investigated. Results obtained from the metallography, scanning electron microscope (SEM) mapping, energy dispersive spectrometer (EDS) line profile, and Auger electron spectroscopy find that the cracks in the welded joints occur around the Au rich boundaries. The SEM...
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