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In this paper an improved LED (Light emitting diode) packaging structure was proposed, which is based on COB (Chip On Board) technology. This research mainly analyzed the thermal reliability of a 4×4 square LED die array with COB technology during temperature load. Simple intuitive for observation, two specific red glue curing profiles were compared with different curing temperature, curing time,...
In this paper, the high power LED system dissipation equipment is analyzed, in this LED system,consisting of nine chips and each chip is 3W. The novel dissipation equipment is design and analyzed, which is composed of vapor chamber, heat pipe array and fins. Vapor chamber as the thermal diffusion layer, it is effectively reduces the spreading resistance from LED chips to heat pipe. The other two models...
In Flip Chip package, the curing process of the underfill polymer will induce extra residual stress and strain fields. For simplicity reasons, in thermo-mechanical analyses, the curing induced stress state was usually neglected by assuming a so-called ldquostress-freerdquo temperature. However, such simplification is not verified, in particular for advanced IC chips such as copper-low-k interconnects,...
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