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Ammonium pyrrolidine dithiocarbamate (APDTC) monolayer was self-assembled on fresh copper surface obtained after oxidation–reduction cycle treatment in 0.1molL −1 potassium chloride solution at ambient temperature. The APDTC self-assembled monolayer (SAM) on copper surface was investigated by surface enhanced Raman scattering spectroscopy and the results show that APDTC SAM is chemisorbed...
The immobilized sucrase capsule of 3.0mm diameter was prepared by chitosan and sodium carboxymethyl cellulose (CMC) ion interaction. The immobilization conditions were optimized as following: The sucrase was dissolved in chitosan solution with the concentration of 2.0%. The solution was dropped into the CMC solution with concentration of 1.5%, and the formed capsules were kept hardening for 24h at...
In this paper, the high power LED system dissipation equipment is analyzed, in this LED system,consisting of nine chips and each chip is 3W. The novel dissipation equipment is design and analyzed, which is composed of vapor chamber, heat pipe array and fins. Vapor chamber as the thermal diffusion layer, it is effectively reduces the spreading resistance from LED chips to heat pipe. The other two models...
In Flip Chip package, the curing process of the underfill polymer will induce extra residual stress and strain fields. For simplicity reasons, in thermo-mechanical analyses, the curing induced stress state was usually neglected by assuming a so-called ldquostress-freerdquo temperature. However, such simplification is not verified, in particular for advanced IC chips such as copper-low-k interconnects,...
With the development trend of microelectronic system with small size, high speed, high frequency and high density, passive and active components are directly embedded into a core or high-density-interconnect layers. This System-in-Package (SiP) technology could shorten interconnection between the die and substrate and reduce the inductance and noise interference. However, there are many electrical...
The plastic deformation kinetics of electrodeposited (EP) Cu foil with grain size d=0.6μm was determined at 293-448 K without and with a concurrent electrostatic field E=2.5kV/cm and compared with that for vapor-deposited (VP) Cu foil tested at 77-473 K without a field. The electric field produced a 20-25% decrease in the flow stress of the EP Cu. The apparent activation volume v=kT ln/ σ both without...
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