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The mechanism and morphological evolution of a thermal interface material prepared by pressureless sintering of a paste containing bimodal silver nanoparticles (AgNPs) were investigated. A high thermal conductivity (232 Wm−1K−1) was obtained from the material sintered at 250 °C for 30 min. These results could be ascribed to decrease of the defect densities and sintered densities of the sintered structures.
Rapid pressureless low temperature sintering of Ag nanoparticles for bonding is achieved. Organic shells adsorbing on the surface of Ag nanoparticles to stabilize them are thinned to be a sparse protecting layer. Numerous coherent twin boundaries formed in sintered Ag nanoparticles with a grain size of 21 nm induce ultra-high thermal conductivity (229 W/m·K), which overcomes the intrinsic defect that...
Rapid pressureless low temperature sintering of Ag nanoparticles for bonding is achieved. Organic shells adsorbing on the surface of Ag nanoparticles to stabilize them are thinned to be a sparse protecting layer. Numerous coherent twin boundaries formed in sintered Ag nanoparticles with a grain size of 21 nm induce ultra-high thermal conductivity (229 W/m·K), which overcomes the intrinsic defect that...
This paper describes a method to achieve rapid pressureless low-temperature sintering of Ag nanoparticles for bonding. Organic shells adsorbing on the surface of Ag nanoparticles to stabilize them were thinned to create a sparse protecting layer. The numerous coherent twin boundaries formed in sintered Ag nanoparticles with a grain size of 21nm induce ultrahigh thermal conductivity (229Wm −1 ...
We report a Cu-to-Cu interconnects fabrication process based on the pressureless low temperature sintering of Ag nanoparticles for electronic packaging. The organic shells of citrates covering the nanoparticles stabilize the Ag nanoparticles. It is not necessary for organic shells to be completely decomposed for sintering to take place. Instead, it is sufficient that the chemical bonds that connect...
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