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The spatiotemporal behavior of microplasmas produced with a silicon microchannel device having a transverse electrode structure has been studied by optical microscopy. For the experiments reported here, the microchannels have a width of 50 µm and a depth of ∼30 µm, and are fabricated in a 380 µm thick Si wafer, Along the rim of the channel is deposited a metal film electrode that is periodic having...
In this article, we proposed a novel SOI technology for introducing thin BOX SOI structure into bulk Si wafer and demonstrated thin body SOI transistors with the thinnest BOX thickness of 7 nm ever reported. Owing to thin BOX and thin body structure, they showed good VTH controllability and effective ION/IOFF controllability exceeding thick BOX transistors. Their small variation was also confirmed...
A thick Cu column based double-bump flip-chip structure is one of the promising alternatives for fine pitch flip-chip applications. In this study, the thermal cycling (T/C) reliability of Cu/SnAg double-bump flip-chip assemblies was firstly investigated and the failure mechanism was analyzed through correlation of T/C test and the finite element analysis (FEA) results. In addition, the effect of Cu...
Thick Cu column based double-bump flip-chip structure is one of the promising alternatives for fine pitch flip-chip applications. In this study, the thermal cycling (T/C) reliability of Cu/SnAg double-bump flip-chip assemblies was mainly investigated and the failure mechanism was analyzed through the correlation of T/C test results and the finite element analysis (FEA). T/C failures occurred from...
In this paper, a MEMS probe card developed with high aspect ratio post in order to implement high speed and high frequency testing and reduce thermal deformation effect during hot test of device under test (DUT) is discussed. High aspect ratio posts were fabricated by nickel electroplating after silicon etching and oxidation performed by a deep RIE etcher and furnace, respectively. Probe card makes...
When ultrasound propagates on the layered substrate, the phase and group velocities of surface wave are varied with the frequency, and dispersion which reflects properties of layered materials can be determined from the critical angles of surface wave for various frequencies. In the present work, broadband surface wave were generated by oblique incident, and wave reflected at the edge of specimen...
Summary form only given. The array of Si microcavity plasma device is a new light source for generating emission with high efficiency and pixel-to-pixel uniformity. As the device operates with specific power loading higher than tens of kW/cm3, it can achieve any region of emission wavelengths between UV and IR through the discharge of various atomic or molecular gases. In this paper, we report the...
Summary form only given. Microcavity plasma devices are a promising technology for generating optical emission with high efficiency and brightness within microcavities having volumes of nanoliters or less. Silicon-based microplasma devices are of particular interest because they can be integrated with other Si-based optoelectronic devices and systems and are amenable to mass production by processes...
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