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In this study, bonding time for touch screen panel (TSP) assemblies were reduced by two third using an ultrasonic (U/S) horn which fits the shape of the entire TSP bonding area. Most TSPs have at least two bonding areas on the substrates with different heights due to structural design of touch sensing. Using conventional thermo-compression anisotropic conductive film (ACF) bonding, each bonding area...
In this study, the effects of vertical ultrasonic (VUS) bonding parameters such as vibration amplitudes and bonding pressures were investigated and optimized in terms of thermal deformation of TSP polymer substrates, electrical continuity, and pull adhesion strength of anisotropic conductive adhesive (ACA) joints. And the reliability of VUS bonded TSP ACA joints were evaluated at various test conditions...
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