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High aspect ratio Cu-rich Cu–Ni microcolumns have been fabricated on brass substrates by Localized Electrochemical Deposition using a platinum microanode with an electrical bias of 7.0V. Sulfate–citrate baths with and without the presence of saccharine as a grain-refining agent, have been used. The microcolumns are ~100μm in diameter and several hundreds of micrometers in height. The addition of saccharine...
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