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Recently, semiconductor industries have integrated more cores in a single die, which substantially improves the throughput of the processors running highly-parallel applications. However, many existing applications do not have high enough parallelism to exploit multiple cores in a die, slowing the transition to many-core processors with smaller and more cores that benefit future applications with...
Because of the wide deployment of 802.11 equipments in the past decade, current applications are not limited anymore to only single access points (AP) deployments for indoor usage, but have been extended to multi-hop networks to fulfill the need of high speed connectivity in mobile environments, where the analysis of multi-hop networks is extremely complicated. The behavior of an AP is dependent not...
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