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A low cost & feasible system on package solution on the basis of BCB and silicon wafer (10 Ohm·mm)-Si-Based 3D MMCM package solution is presented in this paper. What is more, a standard Si-Based MEMS process is employed to achieve package and revision of a GaAs-Based Monolithic Amplifier circuit. The measured results show that input return loss is less than 20 dB; moreover, small signal gain is...
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