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Ultrasonic bonding was widely used to seal polymer microfludic chips due to its high strength, low cost and good biocompatibility. However, in the process of ultrasonic bonding, the easy clogging of microchannels and the difficulty of controlling microchannel heights limit the use of ultrasonic bonding in mass fabrication. In this study, energy director's structure including director protrusion, bonding...
Some issues, such as the removing of air bubbles from bonding interface, microchannel clogging by adhesive, the methods to increase bonding efficiency, as well as the adhesive bonding of a multilayer chip, still limit the use of adhesive bonding in the mass fabrication of microfluidic devices. In this work, an automatic adhesive bonding machine is developed which can obviously increase bonding efficiency...
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