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This paper aims to investigate the electromigration phenomenon of under-bump-metallization (UBM) and solder bumps of a flip-chip package under high temperature operation life test (HTOL). UBM is a thin film Al/Ni(V)/Cu metal stack of 1.5μm; while bump material consists of Sn/37Pb, Sn/90Pb, and Sn/95Pb solder. Current densities of 2500 and 5000A/cm 2 and ambient temperatures of 150–160°C are...
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