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A novel low temperature wafer-level Cu-Cu bonding method using Ag nanoparticles (NP) was proposed and realized in this paper. A bonding structure consisted of Cu bonding pads, TiW barrier/adhesive layer was firstly fabricated on the silicon wafer. Ag NPs were then deposited by physical vapor deposition (PVD) on Cu pads. The morphology of Ag NPs annealed at different temperature was studied. Bonding...
Silicone rubber insulators are widely used in the power grid. An accurate estimation of the insulator aging status is necessary for electric power safety. In this study, a novel unilateral nuclear magnetic resonance (NMR) method to quantify insulator aging status is proposed. Firstly, a unilateral NMR sensor was designed specifically for measuring the transverse relaxation time (T2) of insulators...
Hydrogen (H2), carbon monoxide (CO), and some hydrocarbon gases such as methane (CH4), ethane (C2H6), ethylene (C2H4) and acetylene (C2H2) are the typical fault gases extracted from transformer oil. Based on the framework of Density Function Theory (DFT), tin oxide SnO2 surface model, gas molecular models and adsorption models were built, responsibility. A first principles calculation using Cambridge...
In order to lower Cu-Cu bonding temperature and shorten bonding time applied for 3D integration, nanostructure has been introduced on bonding Cu surface. However, few studies have been reported on Nano Particles (NPs) formation by film deposition process such as pulsed laser deposition (PLD), which would be compatible with CMOS process. In this work Ag nanostructure containing strings of NPs was formed...
In this paper, wafer level room temperature ultrafine pitch Cu-Cu direct bonding was accomplished followed by annealing process at the temperature of 300 °C for 30 min. Cu pad pitches of 15μm, 20μm and 25μm with different pad size of 2μm, 3μm and 4μm were designed and fabricated on 300mm wafers. Additionally, Cu pad pitch of 6μm, 7μm, 8μm with Cu pad size of 3μm was also designed on the wafer by considering...
For the operational spaceborne scatterometers, there is no effective way to eliminate the influence of the rain. Echoes contaminated by the rain are discarded directly. In this paper, a special designed spaceborne scatterometer and its decoupling methods of echoes from sea surface and rain are introduced. The main steps of decoupling methods are as follows. First, the scatterometer system parameters...
The icing flashover is increasingly becoming a serious problem with the development of the extra-high voltage engineering. Reducing the bonding strength between the substrate and the ice by super-hydrophobic coating is a choice for the anti-icing. The bare insulator, RTV coated insulator and the super-hydrophobic insulator are chosen for comparing. The experimental facility is set up. The vertical...
Copper chemical mechanical polishing (CMP) and wafer thinning technologies have been challenges for Through Silicon Via (TSV) interconnect in recent years. In this work, copper CMP slurry and process and wafer level thinning with temporary bonding were studied in detail. The concentration of peroxide (H2O2), citric acid, SiO2 particle and Benzotriazole (BTA) in the CMP slurry and their effects were...
TiN diffusion barrier layers were deposited on SiO2/Si substrate by ALD method that employed TiCl4 and NH3 as the source and reactant gases, respectively, at a temperature range between 350°C and 500°C. Properties of films, including deposition rate, resistivity, surface roughness and chemical composition, were investigated, and performance of TiN diffusion barrier layer was also verified. Deposition...
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